How to design a PCB power supply? Analysis of popular topics and hot content on the entire network in the past 10 days
In recent years, with the complexity of electronic devices, PCB power supply design has become the focus of attention of engineers and enthusiasts. This article combines popular topics across the network for the past 10 days to structure and organize the key points of PCB power supply design to help readers quickly master core knowledge.
1. Popular topics on PCB power supply design in the past 10 days
| Ranking | topic | Popularity index | Main discussion points |
|---|---|---|---|
| 1 | PCB power supply layout tips | 95 | High-frequency noise suppression, ground plane segmentation |
| 2 | Switching power supply PCB design | 88 | EMI optimization, heat dissipation treatment |
| 3 | Multi-layer board power distribution | 82 | Power layer planning, impedance control |
| 4 | LDO and DC-DC selection | 76 | Efficiency comparison, application scenarios |
2. Key points of PCB power supply design
1. Power supply layout principles
A reasonable power supply layout is the basis for ensuring system stability. The following three points are emphasized in the hot discussion:
(1) The power supply path should be as short as possible and wide as possible to reduce the voltage drop and parasitic inductance
(2) Digital/analog power supplies need to be strictly separated to avoid noise coupling
(3) Large current devices should be placed close to the power input terminal
2. Comparison of common power solutions
| type | efficiency | cost | Applicable scenarios |
|---|---|---|---|
| LDO linear voltage stabilization | 60-75% | Low | Low noise, low current |
| Buck buck circuit | 85-95% | middle | Medium-high power applications |
| Boost boost circuit | 80-90% | middle | Battery-powered equipment |
3. Thermal management skills
Recent hot discussions have paid special attention to heat dissipation design:
(1) High-power devices are preferred to be placed on the edge of the PCB
(2) Use a heat dissipation via array (heat vias)
(3) Copper foil area and thickness selection suggestions
3. Special precautions for designing high-frequency power supplies
According to the latest industry discussions, high-frequency power supply design requires additional attention:
1. Power Integrity Analysis (PI)
2. Selection and layout of decoupling capacitors
3. Use of 3D electromagnetic field simulation tools
| Frequency range | Recommended capacitor types | Layout requirements |
|---|---|---|
| ＜1MHz | Electrolytic capacitor | Power supply entrance |
| 1-100MHz | Ceramic capacitors | Close to the IC pin |
| ＞100MHz | High frequency MLCC | Directly below the chip |
4. Latest tools and technology trends
According to the technology forum discussion in the past 10 days, the following tools and technologies have received great attention:
1. Altium Designer Power Supply Simulation Module
2. Cadence Sigrity Power Integrity Solution
3. Artificial Intelligence Assisted PCB Wiring Technology
5. Frequently Asked Questions
Q: How to choose the thickness of the power layer?
A: Calculated according to the current size, generally 1oz copper thickness can carry 1A/mm² current, and it is recommended that large currents be 2oz or more.
Q: What should be paid attention to when dividing the power layer?
A: The dividing line cannot form a long slot antenna, and the spacing between different power domains is at least 3 times the thickness of the medium.
Q: How to test power supply noise?
A: Use an oscilloscope with sufficient bandwidth, use a ground spring probe, and select the IC power pin at the measurement point.
Through the above structured organization, I believe that readers have a more systematic understanding of PCB power supply design. In actual design, it is recommended to combine specific application scenarios, refer to the latest technological development trends, and continuously optimize the design plan.
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